HumiSeal®1C49 Silicone Conformal Coating
HumiSeal®1C49 is a moisture curing, high build, VOC-free silicone conformal coating which provides excellent
moisture and environmental protection for printed circuit assemblies. HumiSeal®1C49 is solvent free. The coating
demonstrates outstanding flexibility, fluoresces under UV light for ease of inspection and can be repaired. HumiSeal®
1C49 can be cured at room or at elevated temperatures. HumiSeal®1C49 is MIL-I-46058C qualified, IPC-CC-830 and
RoHS Directive 2011/65/EU compliant, and recognized under UL File Number E105698.
Properties of HumiSeal®1C49
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Density, per ASTM D1475
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0.97 ± 0.03 g/cm³
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Min. Solids Content, % by
weight per Fed-Std-141, Meth. 4044
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95 %
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Viscosity, per
Fed-Std-141, Meth. 4287
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9000 ± 1500 centipoise
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VOC
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0 grams/litre
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Recommended Coating
thickness
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50 - 200 microns
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Drying Time to Handle per Fed-Std-141, Meth. 4061
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3 - 5 hours
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Recommended Curing Conditions
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24 hrs @ RT or 20 min @
76°C*
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Time required to Reach Optimum Properties
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7 days
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Recommended Stripper
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HumiSeal® Stripper 1091
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Shelf Life at Room Temperature, DOM
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12 months
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Thermal Shock, 50 cycles per
MIL-I-46058C
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-65°C to 200°C
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Coefficient of Thermal Expansion - TMA
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367 ppm /ºC
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Glass Transition Temperature - DSC
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< -65°C
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Modulus ? DMA
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408 MPa @ -40ºC
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1.6 MPa @ 25ºC
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1.4 MPa @ 80ºC
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Tensile per ASTM D-412
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30-50 psi
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Elongation per ASTM D-412
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80-120 %
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Build per Dip, per ASTM D823
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5 mils
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Flammability, per
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V-1
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Dielectric Withstand
Voltage, per MIL-I-46058C
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>1500 volts
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Dielectric Breakdown
Voltage, per ASTM D149
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7000 volts
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Dielectric Constant, at
1MHz and 25°C per ASTM D150-98
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2.5
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Dissipation Factor, at
1MHz and 25°C per ASTM D150-98
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0.01
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Insulation Resistance, per
MIL-I-46058C
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5.0 x 1014 ohms (500TΩ)
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Moisture Insulation
Resistance, per MIL-I-46058C
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1.0 x 1010 ohms (10GΩ)
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Fungus Resistance, per
ASTM G21
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Passes
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